Hardware Manual MAAS-DSP-Board V0.9

Author:               Thomas Musil
Project:                D.I. Winfried Ritsch
Developed at:      Institute of Electronic Music (IEM),
                            University of Music and dramatic Arts in Graz, Austria

The MAAS-DSP-Board and the I/O-Modules are part of the MAAS-Project.
The MAAS-hardware is divided into 3 groups:

  • MAAS-DSP-Board (MAAB)
  • Module-Interface-Boards
  • I/O-Module-Boards (DAC, ADC)
The heart of MAAS-Hardware is the MAAS-DSP-Board. It could be inserted into a PCI-Slot of a Host-Computer or operate as stand-alone  card. Each Module-Interface separates the particular data-slot of each data-frame from the ESSI-Trasmit-Data-stream and passes it on to the appropriate Output-Module; the data coming from each Input-Module is merged into the ESSI-Receive-Data-stream in the particular data-slot by the appropriate Module-Interface.
    MAAS-Scheme
Several hardware mounting-options of MAAB are possible (see Mounting-Options).
Several I/O-configurations of the ESSI are possible.

    2. Files and Description

      2.1 Schematic Circuit Diagram

 
MAAB-Scheme

The schematic circuit diagram of MAAB is shown in 12 files: 6 post-script-files for printing and 6 GIF-files for displaying.
 

ps.gif    schematic_1.ps (721 kb) gif.gif    schematic_1.gif (27 kb)
ps.gif    schematic_2.ps (409 kb) gif.gif    schematic_2.gif (20 kb)
ps.gif    schematic_3.ps (399 kb) gif.gif    schematic_3.gif (22 kb)
ps.gif    schematic_4.ps (427 kb) gif.gif    schematic_4.gif (27 kb)
ps.gif    schematic_5.ps (174 kb) gif.gif    schematic_5.gif (14 kb)
ps.gif    schematic_6.ps (264 kb) gif.gif    schematic_6.gif (14 kb)
(back to Table of Contents)

      2.2 Printed Circuit Board Layout

 The different layers of the printed circuit board layout are shown in 18 files: 9 post-script-files for printing and 9 GIF-files for displaying.
 
ps.gif    top_placing.ps (260 kb) gif.gif    top_placing.gif (11 kb)
ps.gif    top_solder_stop.ps (59 kb) gif.gif    top_solder_stop.gif (8 kb)
ps.gif    top_copper.ps (173 kb) gif.gif    top_copper.gif (16 kb)
ps.gif    ground_layer_2.ps (61 kb) gif.gif    ground_layer_2.gif (8 kb)
ps.gif    supply_layer_3.ps (55 kb) gif.gif    supply_layer_3.gif (9 kb)
ps.gif    bottom_copper.ps (143 kb) gif.gif    bottom_copper.gif (12 kb)
ps.gif    bottom_solder_stop.ps (49 kb) gif.gif    bottom_solder_stop.gif (7 kb)
ps.gif    bottom_placing.ps (134 kb) gif.gif    bottom_placing.gif (4 kb)
ps.gif    drill.ps (199 kb) gif.gif    drill.gif (12 kb)
(back to Table of Contents)

      2.3 Part List

 
 
Reference-Designator: # Value / Part-Description: Package / Lead- 
Dimension:
C1 1 390 pF, 50 V, SMD Ceramic-Multilayer Capacitor Chip-Size 1206
C2,C10.....C58,C62,C66, C68,C70,C72,C74 56 100 nF, 50 V, SMD Ceramic-Multilayer Capacitor Chip-Size 1206
C3,C4 2 22 pF, 50 V, SMD Ceramic-Multilayer Capacitor Chip-Size 1206
C6,C59,C63,C67,C69, C71,C73,C75......C8 14 47 µF, 16 V, Leaded Radial Aluminum-Electrolytic Capacitor LS = 5mm
C7,C8 2 1.0 µF , 35 V, Leaded Radial Tantalum-Electrolytic Capacitor LS = 5mm
C9 1 470 µF, 10 V, Leaded Axial Aluminum-Electrolytic Capacitor LS < 20mm, 
Diameter < 10mm
C60,C61,C64,C65, C82,C83 6 10 µF , 16 V, Leaded Radial Tantalum-Electrolytic Capacitor LS = 5mm
C84.......C89 6 10 µF , 10 V, SMD-Chip Tantalum-Electrolytic-Capacitor Chip-Size (l×w×h) = 
6×3.2×2.5 mm
F1,F4 2 RUE110, PTC-Multi-Fuse, 
1.1A / 2.2 A, Leaded		 LS = 5mm
F2,F3,F5,F6 4 RXE020, PTC-Multi-Fuse, 
0.2A / 0.4 A, Leaded		 LS = 5mm
IC1 1 DSP56301PW80, 
Motorola 3.3V-DSP		 SMD TQFP208 
(pdf-datasheet)
IC2 1 AT29LV512-20JC, Atmel 3.3V- 
Flash-PROM, 64k × 8, 200 ns		 SMD PLCC32 
(pdf-datasheet)
IC3.....IC5 3 UM61L256A-10, UMC 3.3V- 
Fast-Static-RAM, 32k × 8, 10 ns		 UM61L256A-10, UMC 3.3V-Fast-Static-RAM, 
32k × 8, 10 ns 
(pdf-datasheet)
IC6......IC8 3 74HCT377, Octal-D-FF + Enable, 
Leaded		 DIL 20 (pdf-datasheet)
IC9,IC11,IC12,IC14 4 74HCT125, Quad-Line-Driver, 
Leaded		 DIL 14 (pdf-datasheet)
IC10,IC13 2 74HCT126, Quad-Line-Driver, 
Leaded		 DIL 14 (pdf-datasheet)
IC15 1 74HCT241, Octal-Bus-Driver SMD SO20 
(pdf-datasheet)
IC16 1 Quartz-Oscillator, Leaded,16 MHz Metal-Case, DIL8 
(pdf-datasheet)
IC17 1 PC900V, Optocoupler, Leaded DIL 6 (pdf-datasheet)
IC18 1 74LS07, Hex-Buffer, Leaded DIL14 (pdf-datasheet)
IC19 1 MAX 811 LCUS-T, 5V-Under-Voltage-Sensor and Reset-Controller SMD SOT-143 
(pdf-datasheet MAX811) 
(pdf-datasheet MC34164)
IC20 1 LT1085 CT-3.3, Linear-Techn. 3V3-Lowdrop-Voltage-Regulator, Leaded TO 220 
(pdf-datasheet)
IC17" 1 IC-Socket, Leaded DIL6
IC9".......IC14",IC18" 7 IC-Socket, Leaded DIL14
IC6"......IC8" 3 IC-Socket, Leaded DIL20
JP1,JP2, CON2.....CON6,CON8 2 Dual-Pin-Array, 2×50 , Leaded, Vertical LS = 2.54 mm
CON2 1 SCSI-2-Socket, 50 poles, 90-Degree, Leaded
CON7 1 D-SUB-9-Socket, 9 poles , 90-Degree, Leaded, Female
SW1 1 Micro-Push-Button , 90-Degree, Leaded
R1 1 680 k, Leaded Resistor
R2.....R7,R9 7 10 k, SMD-Chip-Resistor Chip-Size 1206
R8 1 1k, Leaded Resistor
R10.....R14 5 220 E, Leaded Resistor
R17 1 150 E, Leaded Resistor
RN1,RN3,RN5.....RN7 5 8×10k L09-1, Leaded Resistor-Array SIL9
RN2,RN4 2 8×1k L09-1, Leaded Resistor-Array SIL9
Q1 1 Quartz , 17 MHz , Leaded, Vertical  Metal-Case, HC 18/U
D1 1 1N4148, Diode, 100 mA, 100 V , Leaded
D3 1 1N5819, Schottky-Diode , Leaded
LED1 1 Green LED, Leaded Diameter = 3mm
(back to Table of Contents)

      2.4 Gerber Files

For producing a PCB, you need 6 gerber-files and their aperture-files plus 1 excellon-drill-file and its drill-configuration-file. There are 2 solder-stop-files, 1 top-layer-file, 1 bottom-layer-file and 2 inner-layer-files in gerber-format. There is also one drill-file in excellon-format. All files are seen from top-view and not mirrored. The 2 solder-stop-files and the 2 inner-layer-files are displayed inversely. The order of the following gerber-files is the same as the arrangement of the layers in the PCB.
 
top_solder_stop.gerber (50 kb) top_solder_stop.aperture (2 kb)
top_copper.gerber (118 kb) top_copper.aperture (2 kb)
ground_layer.gerber (24 kb) ground_layer.aperture (2 kb)
supply_layer.gerber (26 kb) supply_layer.aperture (2 kb)
bottom_copper.gerber (100 kb) bottom_copper.aperture (2 kb)
bottom_solder_stop.gerber (43 kb) bottom_solder_stop.aperture (2 kb)
drill.excellon (12 kb) drill.configuration (1 kb)
(back to Table of Contents)

    3. Configuration and I/O-Connectors

      3.1 Jumpers

The board contains 5 Jumpers:
  • Jumper-A:    JP2   Pin 7 and Pin 8    Boot-Mode-Bit A (inserted:LOW /  removed:HIGH);
  • Jumper-B:    JP2   Pin 5 and Pin 6    Boot-Mode-Bit B (inserted:LOW /  removed:HIGH);
  • Jumper-C:    JP2   Pin 3 and Pin 4    Boot-Mode-Bit C (inserted:LOW /  removed:HIGH);
  • Jumper-P:    JP2   Pin 1 and Pin 2    PLL-Enable-Bit (inserted:PLL is enabled /  removed:PLL is disabled);
  • Jumper-V:    JP1   Pin 2 and Pin 3    Voltage-Clamp-Bit (inserted:for 3.3V-PCI /  removed:for 5V-PCI).
(back to Table of Contents)

      3.2 Address-Decoding

The DSP56301 has 4 internal chipselect-pins:
  • chipselect AA0 for external SRAM;
  • chipselect AA1 for external Flash-PROM;
  • chipselect AA2 for external 24-Bit-Latch;
  • chipselect AA3 for Expansion-Board (e.g. DRAM).
AA0 selects 32768 × 24 Bit Read & Write;
AA1 selects 65536 × 8 Bit (Data-Bit 0 to 7) Read & Write;
AA2 selects 1 × 24 Bit Write-Only;

(back to Table of Contents)

      3.3 ESSI-Configuration-Latch

  • Bit 00 : S1RFSDIRESSI1-Receive-Frame-Sync-DIRection
  • Bit 01 : S1TCKDIRESSI1-Transmit-Clock-DIRection
  • Bit 02 : S1TFSDIRESSI1-Transmit-Frame-Sync-DIRection
  • Bit 03 : S1RCKDIRESSI1-Receive-Clock-DIRection
  • Bit 04 : S1DT/CTLESSI1-Data/Control-qualifier
  • Bit 05 : S1SRB0ESSI1-Sample-Rate-Bit-0
  • Bit 06 : S1SRB1ESSI1-Sample-Rate-Bit-1
  • Bit 07 : S1SRB2ESSI1-Sample-Rate-Bit-2
  • Bit 08 : S2RFSDIRESSI2-Receive-Frame-Sync-DIRection
  • Bit 09 : S2TCKDIRESSI2-Transmit-Clock-DIRection
  • Bit 10 : S2TFSDIRESSI2-Transmit-Frame-Sync-DIRection
  • Bit 11 : S2RCKDIRESSI2-Receive-Clock-DIRection
  • Bit 12 : S2DT/CTLESSI2-Data/Control-qualifier
  • Bit 13 : S2SRB0ESSI2-Sample-Rate-Bit-0
  • Bit 14 : S2SRB1ESSI2-Sample-Rate-Bit-1
  • Bit 15 : S2SRB2ESSI2-Sample-Rate-Bit-2
  • Bit 16 : S1CTDXESSI1-Configuration-Transmit-Data
  • Bit 17 : S1CCLKESSI1-Configuration-Clock
  • Bit 18 : S1CTENESSI1-Configuration-Transmit-ENable
  • Bit 19 : S1CRENESSI1-Configuration-Receive-ENable
  • Bit 20 : S2CCLKESSI2-Configuration-Clock
  • Bit 21 : S2CTENESSI2-Configuration-Transmit-ENable
  • Bit 22 : S2CTDXESSI2-Configuration-Transmit-Data
  • Bit 23 : S2CRENESSI2-Configuration-Receive-ENable
The 8 Direction-Bits are defined:
  • LOW : DSP -> ESSI;
  • HIGH : ESSI -> DSP;
(back to Table of Contents)

      3.4 ESSI_1-Connector

 
 
Pin: Signal-Name: Signal-Description:
1 S1-12V - 12 V Supply (200 mA Fuse)
2 S1-12V - 12 V Supply (200 mA Fuse)
3 S1+12V + 12 V Supply (200 mA Fuse)
4 S1+12V + 12 V Supply (200 mA Fuse)
5 GND Ground
6 GND Ground
7 S1+5V + 5 V Supply (1 A Fuse)
8 S1+5V + 5 V Supply (1 A Fuse)
9 NC  not connected
10 NC not connected
11 S1+5V + 5 V Supply (1 A Fuse)
12 S1+5V + 5 V Supply (1 A Fuse)
13 GND Ground
14 RESERVED Reseved for future-purpose
15 GND Ground
16 RESERVED Reseved for future-purpose
17 GND Ground
18 S1TFS Transmit-Frame-Sync (IO)
19 GND Ground
20 S1RFS Receive-Frame-Sync (IO)
21 GND Ground
22 S1TCK Transmit-Clock (IO)
23 GND Ground
24 S1RCK Receive-Clock (IO)
25 GND Ground
26 S1TDX Transmit-Data (OUT)
27 GND Ground
28 S1RDX Receive-Data (IN)
29 GND Ground
30 S1CRDX Configuration-Receive-Data (IN)
31 GND Ground
32 S1RFSDIR Receive-Frame-Sync-Direction (OUT)
33 S1RST ESSI-Reset
34 S1TFSDIR Transmit-Frame-Sync-Direction (OUT)
35 S1RCKDIR Receive-Clock-Direction (OUT)
36 S1TCKDIR Transmit-Clock-Direction (OUT)
37 S1DT/CTL Data/Control-Qualifier (OUT)
38 S1SRB1 Sample-Rate-Bit 1 (OUT)
39 S1SRB0 Sample-Rate-Bit 0 (OUT)
40 S1SRB2 Sample-Rate-Bit 2 (OUT)
41 GND Ground
42 S1CTDX Configuration-Transmit-Data (OUT)
43 GND Ground
44 S1CTEN Configuration-Transmit-Enable (OUT)
45 GND Ground
46 S1CCLK Configuration-Clock (OUT)
47 GND Ground
48 S1CREN Configuration-Receive-Enable (OUT)
49 GND Ground
50 KEY not connected and mechan. Key
 
(back to Table of Contents)

      3.5 ESSI_2-Connector

 
Pin: Signal-Name: Signal-Description:
1 S2-12V - 12 V Supply (200 mA Fuse)
2 S2-12V - 12 V Supply (200 mA Fuse)
3 S2+12V + 12 V Supply (200 mA Fuse)
4 S2+12V + 12 V Supply (200 mA Fuse)
5 GND Ground
6 GND Ground
7 S2+5V + 5 V Supply (1 A Fuse)
8 S2+5V + 5 V Supply (1 A Fuse)
9 NC  not connected
10 NC not connected
11 S2+5V + 5 V Supply (1 A Fuse)
12 S2+5V + 5 V Supply (1 A Fuse)
13 GND Ground
14 RESERVED Reseved for future-purpose
15 GND Ground
16 RESERVED Reseved for future-purpose
17 GND Ground
18 S2TFS Transmit-Frame-Sync (IO)
19 GND Ground
20 S2RFS Receive-Frame-Sync (IO)
21 GND Ground
22 S2TCK Transmit-Clock (IO)
23 GND Ground
24 S2RCK Receive-Clock (IO)
25 GND Ground
26 S2TDX Transmit-Data (OUT)
27 GND Ground
28 S2RDX Receive-Data (IN)
29 GND Ground
30 S2CRDX Configuration-Receive-Data (IN)
31 GND Ground
32 S2RFSDIR Receive-Frame-Sync-Direction (OUT)
33 S2RST ESSI-Reset
34 S2TFSDIR Transmit-Frame-Sync-Direction (OUT)
35 S2RCKDIR Receive-Clock-Direction (OUT)
36 S2TCKDIR Transmit-Clock-Direction (OUT)
37 S2DT/CTL Data/Control-Qualifier (OUT)
38 S2SRB1 Sample-Rate-Bit 1 (OUT)
39 S2SRB0 Sample-Rate-Bit 0 (OUT)
40 S2SRB2 Sample-Rate-Bit 2 (OUT)
41 GND Ground
42 S2CTDX Configuration-Transmit-Data (OUT)
43 GND Ground
44 S2CTEN Configuration-Transmit-Enable (OUT)
45 GND Ground
46 S2CCLK Configuration-Clock (OUT)
47 GND Ground
48 S2CREN Configuration-Receive-Enable (OUT)
49 GND Ground
50 KEY not connected and mechan. Key
(back to Table of Contents)

      3.6 DSP-Bus-Expansion-Connector

CON4:

Pin: Signal-Name: Signal-Description:
1 +3V +3.3 V Supply
2 +5V +5 V Supply
3 +3V +3.3 V Supply
4 +5V +5 V Supply
5 GND Ground
6 GND Ground
7 DA12 DSP-Address-Bus-Bit 12 (OUT)
8 /WR Write-Enable (OUT)
9 DA7 DSP-Address-Bus-Bit 7 (OUT)
10 DA14 DSP-Address-Bus-Bit 14 (OUT)
11 DA6 DSP-Address-Bus-Bit 6 (OUT)
12 DA13 DSP-Address-Bus-Bit 13 (OUT)
13 DA5 DSP-Address-Bus-Bit 5 (OUT)
14 DA8 DSP-Address-Bus-Bit 8 (OUT)
15 DA4 DSP-Address-Bus-Bit 4 (OUT)
16 DA9 DSP-Address-Bus-Bit 9 (OUT)
17 DA3 DSP-Address-Bus-Bit 3 (OUT)
18 DA11 DSP-Address-Bus-Bit 11 (OUT)
19 DA2 DSP-Address-Bus-Bit 2 (OUT)
20 /RD Read-Enable (OUT)
21 DA1 DSP-Address-Bus-Bit 1 (OUT)
22 DA10 DSP-Address-Bus-Bit 10 (OUT)
23 DA0 DSP-Address-Bus-Bit 0 (OUT)
24 AA1 Chipselect (OUT)
25 DD6 DSP-Data-Bus-Bit 6 (IO)
26 DD7 DSP-Data-Bus-Bit 7 (IO)
27 DD3 DSP-Data-Bus-Bit 3 (IO)
28 DD5 DSP-Data-Bus-Bit 5 (IO)
29 DD4 DSP-Data-Bus-Bit 4 (IO)
30 DD1 DSP-Data-Bus-Bit 1 (IO)
31 DD0 DSP-Data-Bus-Bit 0 (IO)
32 DD2 DSP-Data-Bus-Bit 2 (IO)
33 DA22 DSP-Address-Bus-Bit 22 (OUT)
34 DA23 DSP-Address-Bus-Bit 23 (OUT)
35 DA20 DSP-Address-Bus-Bit 20 (OUT)
36 DA21 DSP-Address-Bus-Bit 21 (OUT)
37 DA18 DSP-Address-Bus-Bit 18 (OUT)
38 DA19 DSP-Address-Bus-Bit 19 (OUT)
39 DA16 DSP-Address-Bus-Bit 16 (OUT)
40 DA17 DSP-Address-Bus-Bit 17 (OUT)
(back to Table of Contents)

CON6:

Pin: Signal-Name: Signal-Description:
1 AA3 Chipselect (OUT)
2 DA15 DSP-Address-Bus-Bit 15 (OUT)
3 /BG Bus-Grant (IN)
4 /BR Bus-Request (OUT)
5 /BB Bus-Busy (IO)
6 /TA Transfer-Acknowledge (IN)
7 CLKOUT synchr. DSP-Clock (OUT)
8 /CAS Column-Address-Strobe (OUT)
9 AA0 Chipselect (OUT)
10 DD17 DSP-Data-Bus-Bit 17 (IO)
11 /BS Bus-Strobe (OUT)
12 /BL Bus-Lock (OUT)
13 /RESET Board-Reset (OUT)
14 AA2 Chipselect (OUT)
15 KEY not connected and mechan. Key
16 DD9 DSP-Data-Bus-Bit 9 (IO)
17 DD8 DSP-Data-Bus-Bit 8 (IO)
18 DD11 DSP-Data-Bus-Bit 11 (IO)
19 DD10 DSP-Data-Bus-Bit 10 (IO)
20 DD20 DSP-Data-Bus-Bit 20 (IO)
21 DD16 DSP-Data-Bus-Bit 16 (IO)
22 DD21 DSP-Data-Bus-Bit 21 (IO)
23 DD22 DSP-Data-Bus-Bit 22 (IO)
24 DD23 DSP-Data-Bus-Bit 23 (IO)
25 DD12 DSP-Data-Bus-Bit 12 (IO)
26 DD14 DSP-Data-Bus-Bit 14 (IO)
27 DD13 DSP-Data-Bus-Bit 13 (IO)
28 DD18 DSP-Data-Bus-Bit 18 (IO)
29 DD15 DSP-Data-Bus-Bit 15 (IO)
30 DD19 DSP-Data-Bus-Bit 19 (IO)
31 EX/IRQB Extern. Interrupt-Reqest B (IN)
32 EX/IRQA Extern. Interrupt-Reqest A (IN)
33 EX/NMI Nonmask. Interrupt (IN)
34 EX/IRQC Extern. Interrupt-Reqest C (IN)
35 GND Ground
36 GND Ground
37 +3V +3.3 V Supply
38 +5V +5 V Supply
39 +3V +3.3 V Supply
40 +5V +5 V Supply
(back to Table of Contents)

      3.7 MIDI-Connector

 
Pin: Signal-Name: Signal-Description:
1 +MIDI_IN Midi-In (Current In)
2 -MIDI_IN Midi-In (Current Out)
3 +MIDI_OUT Midi-Out (Current Out)
4 -MIDI_OUT Midi-Out (Current In)
5 GND Ground
6 +MIDI_THR Midi-Through (Current Out)
7 -MIDI_THR Midi-Through (Current In)
8 GND Ground
9 NC not connected
(back to Table of Contents)

      3.8 RS-232-Connector

 
Pin: Signal-Name: Signal-Description:
1 NC not connected
2 +RDX Receive Data from Interface to DSP (IN)
3 +TDX Transmit Data from DSP to Interface (OUT)
4 NC not connected
5 GND Ground
6 NC not connected
7 NC not connected
8 GND Ground
9 NC not connected
(back to Table of Contents)

      3.9 DSP-JTAG-Connector

 
Pin: Signal-Name: Signal-Description:
1 TDI Test-Data-Input (IN)
2 GND Ground
3 TDO Test-Data-Output (OUT)
4 GND Ground
5 TCK Test-Clock (IN)
6 GND Ground
7 NC not connected
8 KEY not connected and mechan. Key
9 /RESET DSP-Reset (OUT)
10 TMS Test-Mode-Select (IN)
11 +3V +3.3 V Supply
12 NC not connected
13 /DE Debug-Event (IO)
14 /TRST Test-Reset (IN)
(back to Table of Contents)

    4. Assembling

      4.1 Pre-Checking the PCB

Provided that the DSP is already mounted on the MAAB-PCB,
check the resistance of the following signals with an ohmmeter:
  • +5V to +3V ....... infinite
  • +5V to Ground ....... infinite
  • +3V to Ground ....... medium resistance
  • +12V to Ground ....... infinite
  • -12V to Ground ....... infinite
Afterwards, make sure that the IC1-joints are well soldered and that there are no solder-bridges.
Make sure that the higher potential of the ohmmeter is connected to the higher potential in the circuit and vice versa.
The order of potentials in the circuit is:
  • +12V
  • +5V
  • signals of components supplied with +5V
  •  +3V
  • signals of components supplied with +3V
  • Ground
  • -12V
The supply of the ICs is:
  • IC1....IC5 : +3V
  • IC6....IC19 : +5V
  • IC20 : +5V and +3V
Two pictures of the PCB before mounting: (back to Table of Contents)

      4.2 Mounting and Soldering of Components (Part 1)

If all previous measurements were correct, you should mount and solder the following components:
  • The SMD-Chip-Capacitors C1 .... C4;  C14;  C16 .... C19;  C25 .... C52;  C54 .... C56;  do not mount C5 (see IC19-Patch). Notice that these Capacitors have no mark, so pay attention that you don't get them mixed up. They have no polarity.
  • The leaded Capacitors C6 .... C9;  C75 .... C81;  C85 .... C89. The Aluminum-Electrolytic Capacitors are marked at their "minus"-pins, the Tantalum-Electrolytic Capacitors are marked at their "plus"-pins, the Capacitors in the component-placing-sheets are marked at their "plus"-pins.
  • The Resistor-Arrays RN1 .... RN3 and RN5 .... RN7. If you did not get the arrays with 6 Resistors, you can cut off the last 2 Resistors of an array with 8 (attention: not the marked end).
  • The Resistors R1 and R2;  R4 .... R7;  R17;  do not mount R15 and R16 (see IC19-Patch).
  • The Diode D3;  the LED LED1 (the longer pin is the "plus"-pin);  do not mount D2 (see IC19-Patch). The drill-holes for D3 in the PCB are too small, so you have to bend the leads of D3 and then to cut them off very short (like an SMD). Now you can solder D3 like an SMD.
  • SW1, IC15 and IC20 (first fix IC20 with an M3 screw, then solder it).
  • IC16; if IC16 is available only in a DIL-14 case, you should extend and bend the 2 leads of pin 1 and pin 14.
  • Q1; if Q1 is not available in 1/3-case-height, you should mount Q1 flat on top of IC1, connecting and fixing the case with a 0.5 mm wire to Ground (use the Ground-Via of C3 and C4).
  • JP1, JP2, CON8. The usual size of Pin-Arrays is 2×50, you need 2 of them. You have to divide them into 2×20- + 2×20- + 2×4- + 2×3- + 2×3-parts and 2×20- + 2×20- + 2×4- + 2×4- + 2×1- + 2×1-parts (with a fine saw). (see Mounting-Options)

    • (see ESSI F1...F6, CON2, CON3, CON5, IC6...IC14) (see DSP-Bus-Expansion CON4, CON6)
    • JP1 : 2×1-Pin-Array to Pin 2 and 3;
    • JP2 : 2×4-Pin-Array;
    • CON3 : 2×20-Pin-Array + in between 2×1-Pins leave out + 2×4-Pin-Array;
    • CON4 : 2×20-Pin-Array;
    • CON5 : 2×20-Pin-Array + in between 2×1-Pins leave out + 2×4-Pin-Array;
    • CON6 : 2×20-Pin-Array;
    • CON8 : 2×3-Pin-Array + in between 2×1-Pins leave out + 2×3-Pin-Array.
(back to Table of Contents)

      4.3 IC19-Patch

IC19 was changed: a MAX811CUS-T was used instead of an MC34164. Therefore, you have to patch the circuit around IC19. First you should mount and solder the MAX811CUS-T with its Pins 3 and 4 on the unused Pads 5 ... 8 of IC19. Then you should bridge R15 and patch the following connections with a thin wire:
  • IC19-Pad4 to MAX811-Pin1 (Ground);
  • IC19-Pad2 to MAX811-Pin3 (Master-Reset-Input);
  • IC19-Pad1 to MAX811-Pin2 (Reset-Output);
  • C84-Pad +5V to MAX811-Pin4 (Vcc).
C5, R14, R15 and D2 will not be mounted, R15 has been replaced by a wire-bridge.

(back to Table of Contents)

      4.4 Checking the PCB (Part 1)

Now you should check several connections on the board:
  • +5V to +3V ............ medium resistance
  • +5V to Ground ....... medium resistance
  • +3V to Ground ....... medium resistance
Afterwards, check the IC19-Patch to make sure that the joints are well soldered and that there are no solder-bridges.
The same measuring-rules as in Pre-Checking the PCB are valid.

(back to Table of Contents)

      4.5 Testing the PCB by External Supply (Part 1)

The MAAB  should first be tested stand-alone. You have to solder 2 insolated wires (red and black) to IC20 Pin 1 (Ground = black) and to IC20 Pin 3 (+5V = red). Insert only Jumpers A, C and P (SCI-Bootstrap).

You should own a Voltage-regulated Power-Supply with variable Current-Control.

Adjust the voltage to 5V, the current-control to minimum (about 1 mA) and connect the 2 supply-wires of the PCB to the supply correctly. Then slowly increase the current-control up to 200 mA while you measure the voltage between +3V and Ground (IC20 Pin 2 and 1). The voltage should have 3.3 V , the current of the board should be less than 150 mA. LED1 should give a green light. After pushing SW1, IC15 Pin 1 should be LOW for a short time (min. 140 ms) and afterwards HIGH (5V).

If you have an Oscilloscope, you can check 2 Clock-Signals; at CON6 Pin 7 you should measure a 17 MHz / 3.3 V peak to peak signal; at IC16 Pin 5 (Pin 8 respectivly) you should measure a 16 MHz / 5 V peak to peak signal.

(back to Table of Contents)

      4.6 Mounting-Options

If the previous measurements were correct, you can continue to mount components on the PCB.

        4.6.1 Flash-PROM IC2

  • Stand-alone with external Supply and Flash-Bootstrap

    • Mount and solder IC2 and C10 (after testing: insert only Jumpers B, C and P).
     
  • PCI-Plug-In with Flash-Bootstrap

    • Mount and solder IC2 and C10 (after testing: insert only Jumpers B, C and P).
     
  • PCI-Plug-In with Host-Bootstrap and Flash-Memory

    • Mount and solder IC2 and C10 (after testing: insert only Jumpers A, B and P).
     
  • PCI-Plug-In with Host-Bootstrap and without Flash-Memory

    • nothing (after testing: insert only Jumpers A, B and P) (see Jumpers).
(back to Table of Contents)

        4.6.2 SRAM IC3...IC5

  • Low-Memory-Version

    • nothing.
     
  • High-Memory-Version

    • Mount and solder IC3 .... IC5 and C11 .... C13.
(back to Table of Contents)

        4.6.3 ESSI F1...F6, CON2, CON3, CON5, IC6...IC14

  • ESSI 1 without Supply and without SCSCI-2 CON2

    • Mount and solder CON3, IC6 and DIL-20-socket, IC8 and DIL-20-socket, IC9 ... IC11
    and their DIL-14-sockets, C14, C16 .... C19, ESSI2-option.
     
  • ESSI 1 without Supply and without DIL-Pin-Array CON3

    • Mount and solder CON2, IC6 and DIL-20-socket, IC8 and DIL-20-socket, IC9 ... IC11
    and their DIL-14-sockets, C14, C16 .... C19, ESSI2-option.
     
  • ESSI 1 without Supply and with CON2 and CON3

    • Mount and solder CON2 and CON3, IC6 and DIL-20-socket, IC8 and DIL-20-socket,
    IC9 ... IC11 and their DIL-14-sockets, C14, C16 .... C19, ESSI2-option.
     
  • ESSI 1 with Supply and without SCSCI-2 CON2

    • Mount and solder CON3, IC6 and DIL-20-socket, IC8 and DIL-20-socket, IC9 ... IC11
    and their DIL-14-sockets, C14, C16 .... C19, F1 ... F3, C58 .... C61, C82, C83, ESSI2-option.
     
  • ESSI 1 with Supply and without DIL-Pin-Array CON3

    • Mount and solder CON2, IC6 and DIL-20-socket, IC8 and DIL-20-socket, IC9 ... IC11
    and their DIL-14-sockets, C14, C16 .... C19, F1 ... F3, C57, C59 .... C61, C82, C83, ESSI2-option.
     
  • ESSI 1 with Supply and with CON2 and CON3

    • Mount and solder CON2 and CON3, IC6 and DIL-20-socket, IC8 and DIL-20-socket, IC9 ... IC11
    and their DIL-14-sockets, C14, C16 .... C19, F1 ... F3, C57 .... C61, C82, C83, ESSI2-option.
     
  • without ESSI 2

    • nothing but ESSI1-option.
     
  • ESSI 2 without Supply

    • Mount and solder CON5, IC7 and DIL-20-socket, IC12 ... IC14 and their DIL-14-sockets,
    RN4, C15, C20 .... C22, C53, ESSI1-option.
     
  • ESSI 2 with Supply

    • Mount and solder CON5, IC7 and DIL-20-socket, IC12 ... IC14 and their DIL-14-sockets,
    RN4, C15, C20 .... C22, C53, F4 ... F6, C62 .... C65, C82, C83, ESSI1-option
    (see Mounting and Soldering of Components (Part 1) last item).
(back to Table of Contents)

        4.6.4 Opto-Coupler IC17, IC18, R8...R14, D1, CON7

  • neither MIDI nor RS-232

    • nothing.
     
  • MIDI

    • Mount and solder IC17 and DIL-6-socket;  D1 and R8 .... R14;  IC18 and DIL-14-socket;  C24 and C74;  CON7. The drill-holes for CON7 in the PCB are too small, so you have to press the leads of CON7 a little bit flatter with a pair of pliers.
     
  • RS-232

    • First you have to patch the circuit around IC17, IC18 and CON7. Cut through the trace between CON7 Pin 3 and Via (to IC18 Pin 3); cut through the trace between CON7 Pin 6 and R14 (both on bottom-side of the PCB). Instead of a 220 ohm resistor, use a 10 kohm resistor for R13. Patch CON7 Pin 2 to IC18 Pin 3;patch IC18 Pin 4 to IC17 Pin 4; patch IC18 Pin 6 to CON7 Pin 3; patch CON7 Pin 3 to R14 (the Pin which was cut through with CON7 Pin 6). Solder all patches on the bottom-side of the PCB with a thin wire. Mount and solder R8, R9, R13 and R14;  IC18 and DIL-14-socket;  C24 and CON7. The drill-holes for CON7 in the PCB are too small, so you have to press the leads of CON7 a little bit flatter with a pair of pliers.
(back to Table of Contents)

        4.6.5 DSP-Bus-Expansion CON4, CON6

(back to Table of Contents)

      4.7 Checking the PCB (Part 2)

Now you should check several connections on board again:
  • +5V to +3V ............ medium resistance
  • +5V to Ground ....... medium resistance
  • +3V to Ground ....... medium resistance
Afterwards, check all newly soldered components, to make sure that they have well-soldered joints and no solder-bridges.
The same measuring rules as in Pre-Checking the PCB are valid.

(back to Table of Contents)

      4.8 Testing the PCB by External Supply (Part 2)

The MAAB should be tested stand-alone again. Follow the same procedure as in
Testing the PCB by External Supply (Part 1) . Only the supply-current will increase to 200 mA.

(back to Table of Contents)

      4.9 Plugging the PCB into a PCI-Slot

description is in progress. ...
(back to Table of Contents)